工程经理

职位描述

1. 组建并管理工程团队（工艺工程师、NPI 工程师、设备与工装工程师、技术员），制定岗位职责、工作流程与绩效考核方案；开展技术培训与人才梯队建设，管控部门预算与工程资源，持续营造以数据驱动和持续改进为导向的工程文化。

2. 主导新产品从研发设计到量产的全流程导入（Design → NPI → MP）：参与 DFM/DFA 可制造性评审并输出工艺设计建议，制定工艺方案、试产计划与转产验收标准，主导试产问题闭环与阶段评审（phase-gate），确保新产品按规格、按成本、按时间节点完成量产导入。

3. 主导核心工艺开发与固化，覆盖光学耦合与对准、无源器件贴装与固化、精密组装、焊接与测试等关键工序；开展 DOE 实验设计与工艺窗口验证，推动关键工艺参数固化与标准化，编制并维护作业指导书（WI）、工艺流程图与 PFMEA。

4. 负责良率、直通率、UPH/HPU、报废率等核心制造指标的目标设定、过程监控与持续改善；主导失效分析（FA）与根因分析，运用 SPC、DOE、8D、5Why 等工具推动良率提升与报废降低专项。

5. 推动关键工序的过程能力（CPK）分析与提升，主导制程异常、产品不良及客诉相关工艺问题的分析与整改，输出 8D 报告，并向客户提供工艺验证、可靠性与产能爬坡所需的技术数据与报告。

6. 推动自动化与智能制造在关键工序的应用，主导工装、夹具、设备方案的评估、导入与验收；识别并牵头降本（cost down）项目，持续优化制造成本、生产周期与人均产出。

7. 对接研发、生产、品质、计划、采购等部门，协同推进产品落地与量产爬坡；对接客户与供应商完成技术沟通、工艺评估与问题整改；确保工程文档、工艺变更（ECN）与部门流程符合 ISO 9001 等质量管理体系要求，并落实安全生产与 EHS 规范。

Responsibilities

1. Build and lead the engineering team (process engineers, NPI engineers, equipment and tooling engineers, and technicians). Define roles and responsibilities, workflows and performance appraisal schemes. Deliver technical training and develop the talent pipeline, manage the departmental budget and engineering resources, and foster a data-driven, continuous-improvement engineering culture.

2. Own the full new product introduction cycle from R&D design to mass production (Design → NPI → MP): participate in DFM/DFA manufacturability reviews and provide process design recommendations; develop process plans, pilot run schedules and ramp acceptance criteria; drive closure of pilot issues and phase-gate reviews to ensure new products reach mass production on spec, on cost and on schedule.

3. Lead core process development and stabilization across key operations including optical coupling and alignment, passive component attach and curing, precision assembly, welding and testing. Conduct DOE and process window validation, drive the standardization and locking of critical process parameters, and create and maintain work instructions (WI), process flow charts and PFMEA.

4. Set targets, monitor performance and drive continuous improvement for core manufacturing metrics including yield, first-pass yield, UPH/HPU and scrap rate. Lead failure analysis (FA) and root cause analysis, applying SPC, DOE, 8D and 5Why to deliver yield improvement and scrap reduction programs.

5. Drive process capability (CPK) analysis and improvement for critical operations. Lead the analysis and corrective actions for process abnormalities, product defects and customer complaint-related process issues; issue 8D reports and provide customers with technical data and reports required for process validation, reliability and capacity ramp-up.

6. Promote automation and smart manufacturing in critical operations; lead the evaluation, introduction and acceptance of tooling, fixtures and equipment solutions. Identify and spearhead cost-down projects to continuously optimize manufacturing cost, cycle time and output per headcount.

7. Interface with R&D, production, quality, planning and procurement to drive product launch and volume ramp. Engage with customers and suppliers on technical communication, process assessment and corrective actions. Ensure engineering documentation, process changes (ECN) and departmental procedures comply with ISO 9001 and other quality management system requirements, and enforce safety and EHS standards.

任职要求

1. 教育背景：本科及以上学历，光学工程、光电信息科学与工程、物理学、材料科学、机械工程、自动化、电子工程等理工科专业。

2. 从业经历：8 年以上光通信器件、光模块、半导体或精密电子制造行业的工程/工艺经验，3 年以上工程团队管理经验（含工程师与技术员团队）。

3. 专业能力：精通光学对准与耦合、无源器件贴装、精密组装与测试等核心工艺原理与现场实践，熟悉主流设备与材料；熟练掌握 DFM、FMEA、DOE、SPC、CPK 等工程方法与工具；具备完整的新产品导入与量产爬坡经验。

4. 业绩记录：具备良率提升、HPU/UPH 改善、报废降低与降本项目的成功实操记录；具备关键项目的重大失效分析（FA）案例经验；数据驱动，能通过数据分析定位根因并推动闭环。

5. 管理与综合素质：具备优秀的团队领导、人才培养与跨部门协同能力；沟通表达清晰，抗压能力强，能在多项目并行、交付节点紧张的环境下推进目标达成；责任心强，职业素养良好。

6. 语言与其他：具备良好的英文听说读写能力，能独立对接海外客户与全球团队的技术沟通及英文报告撰写；可接受短期境内外出差，配合多厂区产品转移、转产与爬坡支持需求。

Job Requirements

1. Education: Bachelor's degree or above in Optical Engineering, Optoelectronic Information Science and Engineering, Physics, Materials Science, Mechanical Engineering, Automation, Electrical Engineering or other science and engineering disciplines.

2. Work Experience: At least 8 years of engineering or process experience in optical communication devices, optical transceivers, semiconductors or precision electronics manufacturing, including 3+ years of engineering team management (covering both engineers and technicians).

3. Professional Competencies: Deep knowledge of core process principles and hands-on practice in optical alignment and coupling, passive component attach, precision assembly and testing, with familiarity with mainstream equipment and materials. Proficient in DFM, FMEA, DOE, SPC and CPK methodologies; proven experience in full-cycle new product introduction and volume ramp.

4. Track Record: Demonstrated success in yield improvement, HPU/UPH improvement, scrap reduction and cost-down projects; experience handling critical failure analysis (FA) cases for key projects. Data-driven, able to identify root causes through data analysis and drive issues to closure.

5. Management and Comprehensive Qualities: Strong team leadership, talent development and cross-functional collaboration capabilities. Clear communication, resilient under pressure, able to deliver results in a multi-project environment with tight deadlines. High sense of responsibility and professional integrity.

6. Language and Other: Good command of English in listening, speaking, reading and writing; able to independently handle technical communication with overseas customers and global teams and prepare English reports. Willing to take short-term domestic and overseas business trips to support multi-site product transfer, ramp and production launch.