硬件PM- SoC，深圳(J11669)

职位描述

We are looking for a Senior Hardware Technical Program Manager (TPM) to lead complex SoC and hardware programs from silicon development through mass production. You will work across Chip R&D, Hardware, Firmware/Software, Productization, NPI, and Supply Chain, owning execution from Spec Freeze → Tape-out → Silicon Bring-up → EVT → DVT → PVT → MP.

This is a technical program leadership role, not a schedule-tracking role. You should have strong hardware/SoC understanding, proactively identify technical dependencies and risks, and drive cross-functional teams to decisions and closure.

Key Responsibilities

1. End-to-End Program Ownership

• Own roadmap, milestones, critical path, dependencies, risks, resources, and execution from silicon readiness through MP.

• Drive program reviews, recovery plans, key decisions, and cross-functional execution.

2. SoC / Chip R&D Interface

• Partner with Architecture, Design, Verification, DFT, Firmware, and Silicon Validation teams across Spec Freeze, RTL/Verification, Tape-out, Bring-up, and Silicon Validation.

• Manage dependencies across chip revisions, silicon, board, firmware/BSP, and software; drive silicon issues, errata, workarounds, and feature gaps.

3. Hardware Productization & NPI

• Drive EVT → DVT → PVT → MP, coordinating PCB, Power, Mechanical, Thermal, SI/PI, Validation, Test, Manufacturing, and Supply Chain.

• Ensure design, validation, BOM, component, certification, and manufacturing readiness.

4. Hardware–Software Integration

• Drive integration across Firmware / BSP / Driver / SDK / Linux / Android / RTOS and ensure hardware/software version alignment.

• Lead resolution of hardware–software boundary issues including boot, memory, power, peripherals, performance, and stability.

5. Technical Risk & Cross-Functional Leadership

• Proactively identify technical, schedule, quality, resource, and supply-chain risks; maintain Risk / Issue / Dependency management.

• Lead critical debug / war-room activities and drive issues from root cause → corrective action → verification → closure.

• Translate complex technical issues into clear program impact, mitigation options, and management decisions.

任职要求

Qualifications

• 7+ years of experience in hardware, SoC/chip development, system engineering, NPI, or technical program management.

• Proven experience delivering complex hardware products through EVT → DVT → PVT → Mass Production.

• Strong understanding of SoC / Silicon → Board → Firmware / BSP → Driver → Software dependencies.

• Able to engage in meaningful technical discussions with Chip, Hardware, Firmware, and Software engineers.

• Proven ability to lead large, complex, cross-functional programs without direct reporting authority.

• Strong capabilities in roadmap, critical path, risk/issue, dependency, resource, and change management.

• Bachelor’s degree or above in Microelectronics, Electronics, Electrical Engineering, Computer Science, Communications, or related fields.

• Fluent in Chinese and English, with the ability to read technical documentation and participate in English technical meetings.

• Familiarity with Jira, Confluence, Microsoft 365, or equivalent program management tools.

Preferred / Nice to Have

• Experience in a SoC/chip, semiconductor, OEM/ODM, or consumer electronics company.

• End-to-end experience from Tape-out → Silicon Bring-up → Productization → MP.

• Familiarity with ARM / RISC-V and interfaces such as DDR, eMMC/UFS, PCIe, USB, HDMI, Ethernet.

• Hands-on Firmware / Driver / BSP / SDK development or debugging; familiarity with Linux / Android / RTOS.

• Experience with NPI, manufacturing, supply chain, or mass-production ramp. PMP or equivalent certification is a plus.