SMT高级工艺工程师

职位描述

1、参与新产品导入，从 SMT 生产角度对研发设计输出做评审，提出有利于量产的设计建议

2、建立完善工艺的可制造性要求和准则，并主导制程工艺实现

3、识别和明确治工具需求，对钢网和治工具进行合理化设计和优化，及验收、管理

4、完成新产品顺利生产，确保交付满足客户需求，并在试产后提供生产可行性报告

5、完成 SOP，QC 工程图，DFM，PFEMA 相关文件的制作

6、对产线异常 / 内部 QA / 客诉问题分析改善，8D 报告提供技术支持

7、对新材料、新工艺的导入、工艺参数的优化提供技术支持

8、产品标准工时的合量测量与优化，确保产能提升

9、参与客户审核，解答客户疑问，确保审核顺利完成，并对审核问题点进行改善回复

1、Participate in new product introduction, review R&D design deliverables from the perspective of SMT production, and put forward design suggestions conducive to mass production.

2、Establish and improve process manufacturability requirements and specifications, and lead the implementation of manufacturing processes.

3、Identify and clarify fixture and tooling requirements; conduct rational design and optimization for stencils and toolings, as well as acceptance and daily management.

4、Ensure smooth production of new products to meet customer delivery requirements, and deliver production feasibility reports after trial production.

5、Be responsible for compiling technical documents including SOP, QC Control Plan, DFM and PFEMA.

6、Analyze and resolve production line abnormalities, internal QA issues and customer complaints, and provide technical support for 8D report closure.

7、Provide technical support for the introduction of new materials and new processes, as well as optimization of process parameters.

8、Conduct reasonable measurement and optimization of product standard working hours to promote productivity improvement.

9、Participate in customer audits, respond to customer inquiries, ensure smooth audit progress, and complete improvement and reply for audit non-conformities.

任职要求

1、 本科及以上学历，机械、电气自动化类专业；5年以上SMT工艺经验；

2、精通钢网设计，有良好的钢网开孔和治工具优化经验；有POP/Flip Chip/Underfill工艺工作经验者优先；

3、熟悉电子行业标准，如焊盘封装设计、炉温设置、物料可焊性要求、湿度敏感器件管控等；

4、 熟练使用CAM350、AutoCAD等软件；

1、Bachelor's degree or above, major in Mechanical Engineering, Electrical Automation or related fields; more than 5 years of SMT process experience.

2、Proficient in stencil design, with good experience in stencil opening and fixture/tooling optimization; experience in POP/Flip Chip/Underfill processes is preferred.

3、Familiar with electronic industry standards, such as pad package design, reflow oven temperature setting, material solderability requirements, moisture-sensitive device control, etc.

4、 Skilled in using software such as CAM350 and AutoCAD.