打线工艺工程师

职位描述

1、负责 TO, COC 以及高速 BOX 等光器件的新项目阶段贴片、焊线以及点胶等关键工艺设计，计划工艺正交实验，验证和定型稳健的工艺，确保能够精益量产高质量、高可靠性的产品

2、负责 COC，高速 100G, 400G 以及 800G 等光器件以及光引擎样品制作；以及对应关键工艺平台评估，验证以及导入

3、支持样品量产阶段的工艺相关问题的分析和解决，提供工艺相关的改善方案

4、负责项目小批量与量产阶段工序能力分析、数据整理及分析

5、新产品阶段主导工艺相关的失效分析，建立工艺失效分析流程指引

6、建立工艺的 SPC 监控机制，负责对工程的量产工程师，技术员进行培训

7、负责样品转量产阶段工作文件编写，以及相关工艺标准工时等降低与优化

1.Be responsible for the design of key processes such as die attach, wire bonding and dispensing for new projects of optical devices including TO, COC and high-speed BOX. Design orthogonal process experiments, verify and finalize robust processes to realize lean mass production of products with high quality and high reliability.

2.Conduct sample fabrication of COC, high-speed 100G, 400G, 800G optical devices and optical engines, as well as the evaluation, verification and introduction of corresponding key process platforms.

3.Support analysis and resolution of process-related issues during pilot and mass production, and propose process improvement solutions.

4.Carry out process capability study, data collection and analysis during pilot run and mass production phases.

5.Lead process-related failure analysis for new products, and formulate guidelines for process failure analysis workflows.

6.Establish SPC monitoring system for manufacturing processes, and provide training for production engineers and technicians.

7.Compile manufacturing documents during the transition from pilot sample to mass production, and optimize and reduce standard working hours of relevant processes.

任职要求

1、光电、电子、材料、机械以及通信等相关专业本科及以上学历

2、3 年以上工作经验，至少 1 年及以上研发工艺开发经验，熟悉光器件开发工艺流程，如贴片、焊线，回流焊，耦合等

3、对共晶 / 固晶贴片以及打线等封装工艺与工艺原理，有较深的理解和经验

4、了解高速光器件封装技术，有半导体元器件贴片（共晶 & 固晶）与焊线（球焊 & 楔焊）等经验，优先考虑有光电子器件封装经验者

5、了解市场主流设备，如 FINETECH, MRSI, ASM，K&S, Kaijo 等；以及熟悉设备基本原理，并具备一定的设备程序编程实操能力、或者工艺优化能力

6、了解贴片吸嘴设计选型，以及瓷嘴的选型与材料选择能力

7、学习能力强，具备一定的分析和解决问题的能力，逻辑思维清晰

8、具有扎实的光电子基础知识，具备一定英文沟通和阅读能力

9、具有良好的团队合作精神，有责任心和耐心，严谨细致，工作积极主动

10、具备一定英语读写与沟通能力

1.Bachelor’s degree or above, major in Optoelectronics, Electronics, Materials, Mechanical Engineering, Communications or other related disciplines.

2.Over 3 years of working experience including minimum 1 year of R&D process development experience. Familiar with optical device manufacturing processes such as die attach, wire bonding, reflow soldering and coupling.

3.In-depth understanding and practical experience in packaging processes and principles including eutectic die attach, adhesive die attach and wire bonding.

4.Knowledgeable about high-speed optical device packaging technology with hands-on experience in semiconductor component die attach (eutectic & epoxy die attach) and wire bonding (ball bonding & wedge bonding). Candidates with optoelectronic device packaging experience are preferred.

5.Familiar with mainstream equipment brands including FINETECH, MRSI, ASM, K&S, Kaijo and understand fundamental equipment principles. Capable of practical equipment programming or process optimization.

6.Possess capability for design and selection of die attach nozzles, as well as capillary selection and material evaluation.

7.Quick learner with solid problem-solving skills and clear logical thinking.

8.Solid foundational knowledge of optoelectronics and competent English reading and communication skills.

9.Good team player with strong sense of responsibility, patience, rigorous working attitude and initiative.

10.Able to read, write and communicate in English.